Bob Patti has worked in the electronics and semiconductor technology sectors for over three decades, designing hundreds of chips and implementing many of those into large system platforms. He has spent the last 18 years in the area of 2.5 and 3D integration and very advanced packaging. For that work, he was recognized by Semiconductor Equipment and Materials International trade association in 2009 with a North American SEMI award for his pioneering work in the emerging technical area of 3D IC integration.

In addition to his work in 2.5D and 3D integrated circuit technology, Bob was active in JEDEC as the vice chairman of the Future Memories Task Group (DRR3) and continues to guide the development of high-performance 2.5/3D integrated memories and sensors at several companies.

Today, Bob is the vice president of Hardware for KnuEdge Inc., a world leader in artificial-intelligence platforms. At KnuEdge, he is responsible for the development of some of the world's highest-performance next-generation computers. These platforms are incorporating millions of standard and custom processors attacking new classes of artificial-intelligence problems, including machine learning about machine learning.